1·The characteristic of thermosetting polyphenylene oxide resin copper clad laminates as wel as their application in the high frequency printed circuit board is introduced.
论述了热固性聚苯醚树脂基覆铜板的特性及其在高频印刷电路板上的应用。
2·Include polyoxymethylene, polyamide, polycarbonate, ABS, polyphenylene oxide, polyethylene terephthalate, polysulfone, polyether sulfone, polyimide, polyphenylene sulfide and so on.
主要包括聚甲醛、聚酰胺、聚碳酸酯、ABS、聚苯醚、聚对苯二甲酸乙二酯、聚砜、聚醚砜、聚酰亚胺、聚苯硫醚等。
3·Polyphenylene oxide was successfully added to phenolic resin during the syn- thesis process by using a modifying agent XPY, and a new modified environmental phenolic plastic was made.
使用一种改性剂XPY，在酚醛树脂的合成过程中成功引入了聚苯醚，制得了一种新的改性环保型酚醛塑料。
4·The types, synthesis processes and properties of polyphenylene oxide (PPO) with some functional groups such as bromine, vinyl, amide and so on are reviewed. Its application is also expected.
对官能化的聚苯醚(PPO)树脂的种类、合成方法及性能进行了综述，并对各类树脂的应用前景进行了展望。